High Density Modular Cooling八月 22, 2016
Flexible Cooling Solutions for High Heat Density Systems
High density modular cooling systems deliver energy-efficient and flexible cooling solutions for data centers with more than 30kW per rack. They are available in open or closed architecture and pumped refrigerant-based or water-based technology. These solutions allow expansion without interruption of cooling operations using optional pre-charged flexible piping with threaded quick connect fitting.
Refrigerant-based units are best to use around electronic equipment as they operate at low pressure in the piping circuit and become gas at room conditions. They support a hot aisle/cold aisle approach. They come in floor-mount, rack-mount and ceiling-mount configurations so they require little or no floor space.
Water-based cooling solutions come in rack enclosures or door-mounted models. They leverage the building’s current chilled water system. They offer an alternative heat removal solution to critical applications where the hot aisle/cold aisle approach to cooling is not practical.
Some of these units have easily-installed rack fan unit to provide airflow and energy-efficient design.
High Density Modular Cooling Systems are designed for high density equipment requiring precise cooling and protection, communication enclosure, data centers and servers.
Liebert XD refrigerant-based cooling modules deliver high-density cooling with highly flexible configurations for floor-mount, rack-mount and ceiling-mount applications.
The indoor Liebert XD Pumping and Chiller Units include the Liebert XDP and the Liebert XDC units. These refrigerant-based systems support Liebert XD System spot/zone data center cooling modules, including the Liebert XDO, Liebert XDV,...
The Liebert XDA rack fan unit optimizes data center cooling by increasing air flow through densely populated enclosures, past congested cabling; removing hot spots within the enclosure that can threaten the uptime of your critical syst...